BlockBeats News, July 12th, Samsung Electronics plans to advance the mass production schedule of its first wafer fab in the Yongin Semiconductor Cluster in South Korea by 2 years, aiming to start operation in October 2029. Meanwhile, SK Hynix is considering building a new production facility in the United States, with AI demand driving South Korean semiconductor companies to accelerate their expansion plans.

Samsung Electronics plans to construct a total of 6 wafer fabs in the Yongin National Industrial Complex, with the original schedule for the first fab to start operation in 2031. The government and Samsung have now reached a consensus to bring this forward to October 2029. The South Korean government will expedite key infrastructure construction such as land development, electricity, and water supply to support the project's accelerated timeline.

As for SK Hynix, following its successful listing on NASDAQ on July 10th, the company is contemplating establishing a new production base in the United States. Reports indicate that SK Hynix has been studying plans to establish a semiconductor production foothold in the U.S., focusing on the development of the AI industry since the beginning of this year.

Global memory chip leaders such as Samsung Electronics and SK Hynix are expanding their production capacity to address the chip supply shortage caused by the AI industry. The South Korean government is also promoting the construction of new semiconductor industrial parks and plans to expedite project implementation by streamlining environmental assessments and optimizing approval processes.

Industry insiders stated that despite concerns about the semiconductor cycle reaching a peak, the current market demand for chip capacity remains robust. To compete for dominance in the AI era, expanding semiconductor production capacity has become a key focus.