BlockBeats News, July 14th, according to Korean media ZDNET, SK Hynix has started procuring equipment for the first-phase cleanroom of the Yongin Semiconductor Cluster's Y1 fab, with initial plans to add a monthly capacity of 20,000 wafers of 1c DRAM.

The Y1 fab, originally scheduled to start operating the first-phase cleanroom in May 2027, has now been brought forward to February 2027. The company plans to commence construction of a trial production line at that time, with formal equipment installation taking place between March and April to expand the production capacity by 20,000 wafers per month.

The production line will mainly produce the sixth-generation 10-nanometer 1c DRAM, which can be used in AI-related high value-added DDR and LPDDR products and is planned to be applied to the earliest commercialization of HBM4E in 2027. To expedite equipment introduction, SK Hynix will also advance equipment price contract negotiations, typically held at the end of the year, to early in the third quarter.

SK Hynix is simultaneously accelerating the overall construction progress of the Yongin Semiconductor Cluster. The project has a total investment of approximately 60 trillion Korean won and consists of four fabs, with the completion target of the fourth fab moved up from 2045 to 2033; the construction of the Y1 second and third-phase cleanrooms is expected to start in the second half of this year.