BlockBeats News, July 25th, Citrini analyst Jukan cited the latest industry analysis from ZDNet Korea, pointing out that the AI semiconductor performance competition is shifting from process miniaturization to advanced stacking technology. 3D IC, which vertically integrates logic and memory, is emerging as the key technology for the next generation. Samsung Foundry has recently seen a surge in inquiries about 3D IC, with almost every potential customer inquiring about this technology. However, Jukan believes that 3D IC is essentially a single custom DRAM, and it fundamentally conflicts with the core business model of mass-produced standardization by Samsung and SK Hynix. The two Korean fabs are expected to be limited to preliminary research and remain cautious about full commercialization.

This structural hesitation has opened a window for niche players. China's ChangXin Memory, facing difficulties entering the HBM market due to U.S. semiconductor restrictions, is using 3D IC as a differentiation breakthrough. They have chosen to target custom memory instead of engaging in head-on competition with Korean fabs in the commodity DRAM market. South Korean semiconductor industry officials have stated that China has already taken the lead in producing multiple 3D DRAM sample chips, and niche market participants like ChangXin and Winbond Electronics are likely to be the first to establish this market.

Analyst Jukan had previously pointed out that Nvidia's CUDA moat is coming to an end. The breakdown of software ecosystem barriers and the trend towards customization in 3D IC are happening simultaneously, signaling a potential structural reshuffle in the next-generation AI memory competition landscape.

Note: A niche market refers to a niche area in a large market that mainstream players ignore or are unwilling to enter. Niche players refer to companies that focus on such a segmented market.